Method for embedding thin film sensor in a material
AssigneeWisconsin Alumni Research Foundation
InventorsXiaochun Li, Arindom Datta, Xudong Cheng
Life of this patent
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Abstract
An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process or through a dynamic bonding process. The embedded sensor or other desired device is provided on a substrate through any known or later-developed method. A cover is then bonded to the substrate using a solid-state bonding process or a dynamic bonding process. The solid-state bonding process may include providing heat and pressure to the substrate and the cover to bond the substrate and the cover together. The dynamic bonding process may include heating a bonding agent and distributing the heated bonding agent between the substrate and cover to bond the substrate and the cover together.
Claims18
A method for forming a thin film sensor embedded in a material, the method comprising:
- forming a thin film sensor on or over a surface of a substrate, and
- bonding a cover to the surface of the substrate using a solid-state bonding process or a dynamic bonding process to provide the thin film sensor embedded in the material,
- wherein the material comprises the substrate and the cover, and further wherein the substrate, the cover, or both is sapphire, further comprising forming the embedded sensor into a cutting tool adapted for hard machining, dry machining, friction stir welding, or combinations thereof.
A method for forming a thin film sensor embedded in a material, the method comprising:
- forming a thin film sensor on or over a surface of a substrate, and
- bonding a cover to the surface of the substrate using a solid-state bonding process or a dynamic bonding process to provide the thin film sensor embedded in the material,
- wherein the material comprises the substrate and the cover, and further wherein the substrate, the cover, or both is sapphire, further comprising forming the embedded sensor into a drill bit.
Dependencies are inferred from the claim text.