Techniques for bonding substrates using an intermediate layer
AssigneeMedtronic, Inc.
InventorsDavid A Ruben, Michael S Sandlin
Life of this patent
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Abstract
A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.
Claims17
A device comprising:
- a first glass substrate;
- a second glass substrate;
- and
- an intermediate layer disposed between the first and second glass substrates, wherein the first and second glass substrates are fused together by the intermediate layer, and wherein the intermediate layer is configured to receive a first electromagnetic (EM) radiation through one of the first and second wafers and onto a region of the intermediate layer until the first and second glass substrates are fused in the region without causing the first and second glass substrates to melt or flow.
Dependencies are inferred from the claim text.