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US 9,116,210 B2Granted
Integrated circuit testing module including signal shaping interface
AssigneeRambus Inc.
InventorAdrian E. Ong
Life of this patent
Estimating the term…
Abstract
Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher slew rate than the slew rate at which signals are received from the automated testing equipment.
Claims19
An apparatus, comprising:
- a first component to communicate at a first frequency, the first components comprising a receiving component to receive a test signal at the first frequency and to output information derived from the test signal;
- a data generating component coupled to receive the information from the first component and to generate test data responsive to the information;
- and
- a second component to transmit test data based on the information to at a second frequency different than the first frequency.
1 more element
A method, comprising:
- receiving a first signal having a first frequency from a testing equipment;
- generating a test signal based on the first signal;
- and
- sending the test signal to an apparatus at a second frequency different than the first frequency.
1 more element
Dependencies are inferred from the claim text.