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US 9,115,297 B2Granted
Adhesive composition
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsHirofumi Imai, Koki Tamura, Atsushi Kubo, Takahiro Yoshioka
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Abstract
An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided.
Claims10
An adhesive composition comprising:
- a hydrocarbon resin;
- a first solvent for dissolving the hydrocarbon resin, wherein the first solvent is at least one selected from the group consisting of indene, indane, tetrahydroindene, naphthalene, tetrahydronaphthalene, and decahydronaphthalene (decalin);
- a thermal polymerization inhibitor;
- and
- a second solvent for dissolving the thermal polymerization inhibitor, wherein the second solvent is different than the first solvent, and wherein the second solvent is dihydroterpinyl acetate.
2 more elements
An adhesive composition comprising:
- a hydrocarbon resin;
- a first solvent for dissolving the hydrocarbon resin, wherein the first solvent is at least one selected from the group consisting of indene, indane, tetrahydroindene, naphthalene, tetrahydronaphthalene, and decahydronaphthalene (decalin);
- a thermal polymerization inhibitor;
- and
- a second solvent for dissolving the thermal polymerization inhibitor, wherein the second solvent is different than the first solvent, and wherein the second solvent is selected from the group consisting of butyl acetate, propylene glycol monomethyl ether acetate (PGMEA), and dihydroterpinyl acetate,
- wherein the hydrocarbon resin is a cycloolefin polymer.
3 more elements
Dependencies are inferred from the claim text.