Substrate processing apparatus and manufacturing method for a semiconductor device

A substrate processing apparatus comprising a standby chamber for supporting a substrate in a substrate support jig and maintaining the substrate in standby, a transfer chamber, and a chamber housing a carrier load mount for loading a carrier storing the substrate, which are provided in order along a length direction from the rear side within a case having a maintenance opening for entry of maintenance personnel into the chamber housing the carrier load mount from outside the case, and a processing chamber provided above the standby chamber for processing the substrate, wherein the line segment joining the center of the substrate supported in the substrate support jig, with the center of the substrate on the carrier loaded in the carrier load mount, when at rest position, is offset to an offset side along the width direction with respect to the center line passing through the center of the case width;

• and an opening section disposed in a wall isolating the transfer chamber from the chamber housing the carrier load mount to form an air-tight seal, and a door for opening and closing the opening section are provided at the front side of the transfer chamber on the side along the width direction which opposes the offset side along the width direction and for entry of maintenance personnel into the transfer chamber.

A manufacturing method for a semiconductor device for processing a substrate by utilizing a substrate processing apparatus comprising a load lock chamber, a transfer chamber and a maintenance passage provided in order along a length direction from the rear side within a case having a maintenance opening for entry of maintenance personnel into the maintenance passage from outside the case, a processing chamber provided above the load lock chamber for processing a substrate, and an opening section disposed in a wall isolating the transfer chamber from the maintenance passage of the case to form an air-tight seal, and a door for opening and closing the opening section provided in a location along the length direction at a front side of the transfer chamber and for entry maintenance personnel into the transfer chamber wherein the manufacturing method comprises the steps of:

• carrying the substrate into the load lock chamber from the transfer chamber whose door closes the opening section;
• carrying the substrate into the processing chamber from the depressurized load lock chamber;
• and processing the substrate.