Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
AssigneeSemtech Corporation
InventorsVictor Hugo Cruz, David Francis Courtney
Life of this patent
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Abstract
A high temperature, non-cavity package for non-axial electronics is designed using a glass ceramic compound with that is capable of being assembled and operating continuously at temperatures greater that 300-400° C. Metal brazes, such as silver, silver colloid or copper, are used to connect the semiconductor die, lead frame and connectors. The components are also thermally matched such that the packages can be assembled and operating continuously at high temperatures and withstand extreme temperature variations without the bonds failing or the package cracking due to a thermal mismatch.
Claims14
The method for making a packaged semiconductor device comprising:
- providing a metal plated pad, leadframe having at least one package site, the at least one package site having at least one lead;
- mounting a semiconductor die on the at least one package site using a first metal braze, said first metal braze comprising a silver colloid;
- bonding a connector to the semiconductor die and the at least one lead using a second metal braze, said second metal braze comprising said silver colloid;
- and
- encapsulating and sealing the semiconductor die, the connector and at least part of the metal plated pad, leadframe and the at least one lead within a glass ceramic compound to form a hermetically sealed electronic package, wherein the package is non-cavity and void-less, and said glass ceramic compound is heated to chemically bond said glass ceramic compound to said metal plated pad, said semiconductor die and said connector;
- wherein the connector, the metal plated pad, the leadframe, the semiconductor and the glass ceramic are thermally matched and wherein the glass ceramic has a CTE<5.0×10−6 and a transition temperature>450° C.
Dependencies are inferred from the claim text.