Method for forming a patterned layer on a substrate

A method for forming a patterned layer on a substrate by means of an imprint process comprising the steps of:

• providing a single patterning means;
• providing a first layer on a surface of said substrate;
• simultaneously forming patterns of recesses in the first layer by imprinting said first layer with said patterning means, wherein said patterns of recesses includes a first pattern of recesses and a second pattern of recesses that are wider than said recesses of said first pattern;
• curing said first layer;
• performing a first surface treatment onto said first layer to make a surface of the first layer hydrophilic;
• performing a second surface treatment onto a selected subarea of the surface of said first layer to make said subarea hydrophobic, said subarea including surface portions between said recesses of said first pattern and excluding said recesses of said first pattern;
• and
• depositing a first conducting pattern material into said recesses of said first pattern and a second conducting pattern material that is different from said first conducting pattern material into said recesses of said second pattern, wherein the first and second conducting pattern materials form a single, cohesive electrode,
• wherein the step of depositing said first conducting pattern material into said recesses of said first pattern further comprises performing at least one time the steps of:
• depositing a second layer onto said first layer, wherein said second layer contains polar molecules, and
• allowing said second layer to dry, wherein said second layer is redistributed from said hydrophobic subarea into said recesses of said first pattern, and
• wherein the step of depositing said second conducting pattern material into said recesses of said second pattern further comprises the steps of:
• masking said first and second layers providing unmasked areas,
• depositing a third layer onto said unmasked areas by means of spray pyrolysis of tin/zinc solutions.

A method for forming a patterned layer on a substrate by means of an imprint process comprising the steps of:

• providing a single patterning means;
• providing a first layer on a surface of said substrate;
• simultaneously forming patterns of recesses in the first layer by imprinting said first layer with said patterning means, wherein said patterns of recesses includes a first pattern of recesses and a second pattern of recesses that are wider than said recesses of said first pattern;
• curing said first layer;
• performing a first surface treatment onto said first layer to make a surface of the first layer hydrophilic;
• performing a second surface treatment onto a selected subarea of the surface of said first layer to make said subarea hydrophobic, said subarea including surface portions between said recesses of said first pattern and excluding said recesses of said first pattern;
• and
• depositing a first conducting pattern material into said recesses of said first pattern and a second conducting pattern material that is different from said first conducting pattern material into said recesses of said second pattern, wherein the first and second conducting pattern materials form a single, cohesive electrode and wherein the second conducting pattern material is transparent.