High-frequency circuit module
AssigneeTaiyo Yuden Co., Ltd.
InventorsHiroshi Nakamura, Tomohiro Igarashi
Life of this patent
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Abstract
A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC.
Claims10
A high-frequency circuit module comprising:
- a circuit board including an insulating layer and a conductive layer that are alternately stacked;
- a high-frequency IC installed at the circuit board to transmit and receive a high-frequency signal;
- a power amplifier IC installed at the circuit board to amplify a transmission signal received from the high-frequency IC;
- and
- a duplexer installed between the high-frequency IC and the power amplifier IC to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal output from the antenna and input to the high-frequency IC from each other,
- wherein at least one of the high-frequency IC and the power amplifier IC is embedded in the circuit board.
Dependencies are inferred from the claim text.