Tag integrated circuit module apparatus and method of fabricating tag integrated circuit module apparatus
AssigneesElectronics and Telecommunications Research Institute, Nethom
InventorsWon Kyu Choi, Jong Suk Chae, Seung Hwan Jeong, Chan Won Park, Cheol Sig Pyo, Hae Won Son, Kun Hong Lee
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Abstract
Provided is a tag integrated circuit (IC) module apparatus and a method of fabricating tag IC module apparatus. The tag IC module apparatus may include an n-turn loop coil, n denoting a natural number, connected in series with a tag IC, and a printed circuit board (PCB) disposed below the tag IC and patterned with the n-turn loop coil.
Claims11
A tag integrated circuit (IC) module apparatus, comprising:
- an n-turn loop coil connected in series with a tag IC, n denoting a natural number;
- and
- a first printed circuit board (PCB) disposed below the tag IC and patterned with the n-turn loop coil;
- wherein the tag IC is disposed over opposite ends of the coil on an upper surface of the PCB and connects the opposite ends across a gap separating the opposite ends;
- wherein the n-turn loop inductively couples an induced radio frequency (RF) signal to a metal body and transfers the induced RF signal to the tag IC when the tag IC module apparatus is attached to the metal body.
A method of fabricating a tag integrated circuit (IC) module apparatus, the method comprising:
- patterning an n-turn loop coil on a printed circuit board (PCB), n denoting a natural number;
- disposing the PCB below a tag IC, and connecting the tag IC between opposite mounting electrodes on an upper surface of the PCB across a gap separating the opposite mounting electrodes to connect the tag IC with the n-turn loop coil in series;
- and
- attaching the tag IC module apparatus to a metal body for the n-turn loop coil to inductively couple an induced radio frequency (RF) signal to the metal body and transfer the induced RF signal to the tag IC.
Dependencies are inferred from the claim text.