US 9,095,942 B2 · Wicking and coupling element(s) facilitating evaporative cooling of component(s)

Abstract

Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Claims17

Dependent claims

A cooling apparatus comprising:

a housing at least partially surrounding and forming a compartment about multiple components to be cooled;
a fluid filling a lower portion of the compartment, wherein a component of the multiple components is at least partially non-immersed within the fluid;
a wicking film element physically coupled to a main surface of the component and partially immersed within the fluid disposed within the lower portion of the compartment;
and
a coupling element coupling the wicking film element in physical contact with the main surface of the component without the coupling element overlying the main surface of the component, and without blocking egress of fluid vapor from the wicking film element over the main surface of the component.

2 more elements

A liquid-cooled electronic system comprising:

an electronic system comprising multiple electronic components to be cooled;
a cooling apparatus partially immersion-cooling the electronic system, the cooling apparatus comprising:
a housing at least partially surrounding and forming a compartment about the multiple electronic components to be cooled;
a fluid filling a lower portion of the compartment, wherein an electronic component of the multiple electronic components is at least partially non-immersed within the fluid;
a wicking film element physically coupled to a main surface of the electronic component and partially immersed within the fluid disposed within the lower portion of the compartment;
and
a coupling element coupling the wicking film element in physical contact with the main surface of the electronic component without the coupling element overlying the main surface of the electronic component, and without blocking egress of fluid vapor from the wicking film element over the main surface of the electronic component.

4 more elements

Dependencies are inferred from the claim text.

Wicking and coupling element(s) facilitating evaporative cooling of component(s)

Life of this patent

Wicking and coupling element(s) facilitating evaporative cooling of component(s)

Life of this patent

Abstract

Claims17