Composition of a solder, and method of manufacturing a solder connection

A method of manufacturing an electrically conducting connection between a bonding area at a first substrate and a bonding area at a second substrate using a solder composition, the method comprising:

• providing the solder composition onto the bonding area at the first substrate;
• assembling the first and the second substrate, such that the solder composition is sandwiched between the bonding areas at the first and the second substrate,
• a first of said bonding areas at the first and second substrate containing an alloying metal and a corresponding oxide layer;
• and
• applying the solder composition, the solder composition comprising particles of a thermodynamically metastable alloy dispersed therein, the metastable alloy comprising an element that will make free, and bind, oxygen from the oxide layer of the first of said bonding areas at the first and second substrate so as to replace the oxide layer with an adhesion layer between the first of said bonding areas and said solder composition, the adhesion layer comprising an intermetallic compound with the alloying metal of the first bonding area, wherein the intermetallic compound comprises both an element of the bonding area and an element originating from the particles of the thermodynamically metastable alloy, both of which promote adhesion between the solder composition and at least the first bonding area and electrical conductivity therebetween.