Member for solid-state image pickup device and method for manufacturing solid-state image pickup device having first and second wiring structures with a concave portion between first and second substrates

A method for manufacturing a solid state image pickup device, comprising the steps of:

• providing a first member including a first substrate and a first wiring structure disposed on the first substrate, the first substrate being provided with at least one of a transistor and a photoelectric converter;
• providing a second member including a second substrate and a second wiring structure disposed on the second substrate, the second substrate being provided with a transistor;
• and
• bonding the first member and the second member so that the first wiring structure and the second wiring structure are disposed between the first substrate and the second substrate,
• wherein before the step of bonding, at least one of a face of the first member which is to face the second member and a face of the second member which is to face the first member has a concave portion, and at least a part of the concave portion is formed by a conductive material.