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US 9,090,722 B2Granted
Chemical amplification resist composition, and mold preparation method and resist film using the same
AssigneeFUJIFILM Corporation
InventorsToru Fujimori, Koji Shirakawa, Toshihiro Usa, Kenji Sugiyama, Takayuki Ito, Hideaki Tsubaki, Katsuhiro Nishimaki, Shuji Hirano, Hidenori Takahashi
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Abstract
A chemical amplification resist composition that is used for preparation of a mold, and a mold preparation method and a resist film each using the composition are provided.
Claims19
A method for preparing a mold, comprising:
- coating a chemical amplification resist composition on a substrate to form a resist film,
- performing pattern drawing with an electron beam,
- performing development with a developer to form a resist pattern;
- performing an etching treatment to the substrate having thereon the thus-formed resist pattern by using the resist pattern as a mask to form a concave-convex structure on the substrate,
- wherein
- the chemical amplification resist composition comprises:
- (A) a resin capable of decomposing by an action of an acid to increase the solubility of the resin (A) in an alkali developer,
- wherein the resin (A) has a group represented by the following formula (I) or (II):
- wherein each of R1 and R2 independently represents a hydrogen atom or an alkyl group;
- W represents a divalent organic group;
- and
- R3 represents an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group:
- wherein R1, R2 and W have the same meanings as those in formula (I);
- and
- R4 represents a cycloalkyl group or an aryl group.
12 more elements
Dependencies are inferred from the claim text.