Method for reducing warpage of glass substrate caused by chemical strengthening process, and method for producing chemically strengthened glass substrate
AssigneeAsahi Glass Company, Limited
InventorsNaoki Okahata, Koji Nakagawa
Life of this patent
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Abstract
A method includes: forming at least one layer of a film formed of an inorganic material, that contains H atoms in a concentration of 1.0×1015 to 1.0×1019 atom/mm3, on at least a top surface of a glass substrate having a bottom surface to contact a molten metal during forming and the top surface facing the bottom surface, thereby reducing a warpage of the glass substrate caused by a chemical strengthening process performed after forming the at least one layer on the top surface of the glass substrate. The glass substrate is formed by a float process.
Claims8
A method comprising:
- forming at least one layer of a film formed of an inorganic material, that contains H atoms in a concentration of 1.0×1015 to 1.0×1019 atom/mm3, on at least a top surface of a glass substrate having a bottom surface to contact a molten metal during forming and the top surface facing the bottom surface, thereby reducing a warpage of the glass substrate caused by a chemical strengthening process performed after forming the at least one layer on the top surface of the glass substrate,
- wherein the glass substrate is formed by a float process.
A method for producing a chemically strengthened glass substrate, the method comprising:
- forming at least one layer of a film formed of an inorganic material, that contains H atoms in a concentration of 1.0×1015 to 1.0×1019 atom/mm3, on at least a top surface of a glass substrate having a bottom surface to contact a molten metal during forming and the top surface facing the bottom surface;
- and
- subjecting the glass substrate in which the film has been formed to a chemical strengthening process,
- wherein the glass substrate is formed by a float process.
Dependencies are inferred from the claim text.