Semiconductor light emitting element

A semiconductor light emitting element, comprising:

• a pad unit including a first pad, a second pad, and a third pad, the second pad being separated from the first pad in a first surface, the third pad being separated from the first pad and separated from the second pad in the first surface;
• a first light emitting unit including
• a first semiconductor layer,
• a second semiconductor layer, and
• a first light emitting layer,
• the first semiconductor layer being separated from the pad unit in a first direction and including a first semiconductor portion and a second semiconductor portion, the second semiconductor portion being arranged with the first semiconductor portion in a direction crossing the first direction, the first direction intersecting the first surface, the second semiconductor layer being provided between the second semiconductor portion and the pad unit, the first light emitting layer being provided between the second semiconductor portion and the second semiconductor layer;
• a second light emitting unit including
• a third semiconductor layer,
• a fourth semiconductor layer, and
• a second light emitting layer,
• the third semiconductor layer being provided between the pad unit and the first light emitting unit and including a third semiconductor portion and a fourth semiconductor portion, the fourth semiconductor portion being arranged with the third semiconductor portion in a direction crossing the first direction, the fourth semiconductor layer being provided between the fourth semiconductor portion and the pad unit, the second light emitting layer being provided between the fourth semiconductor portion and the fourth semiconductor layer;
• a first electrode provided between the pad unit and the second light emitting unit;
• an insulating support layer provided between the pad unit and the first electrode;
• a first conductive layer provided between the first light emitting unit and the second light emitting unit, the first conductive layer extending in the first direction and electrically connected with the second semiconductor layer;
• a first inter-light emitting unit dielectric layer provided between the first light emitting unit and the second light emitting unit and between the first conductive layer and the second light emitting unit, the first inter-light emitting unit dielectric layer being light-transmissive;
• a first connection electrode provided between the first semiconductor portion and the third semiconductor layer to electrically connect the first semiconductor portion and the third semiconductor layer, the first connection electrode piercing the first inter-light emitting unit dielectric layer in the first direction;
• a first dielectric layer provided between the first connection electrode and the second semiconductor layer, between the first connection electrode and the first light emitting layer, and between the first connection electrode and the first conductive layer;
• a second connection electrode provided between the third semiconductor portion and the first pad to electrically connect the third semiconductor portion and the first pad, the second connection electrode piercing the insulating support layer in the first direction;
• a second dielectric layer provided between the second connection electrode and the fourth semiconductor layer, between the second connection electrode and the second light emitting layer, and between the second connection electrode and the first electrode;
• a third connection electrode provided between the first conductive layer and the second pad to electrically connect the first conductive layer and the second pad, the third connection electrode piercing the first inter-light emitting unit dielectric layer, the second light emitting unit and the insulating support layer in the first direction;
• a third dielectric layer provided between the third connection electrode and the second light emitting unit and between the third connection electrode and the first electrode;
• and
• a fourth connection electrode provided between the first electrode and the third pad to electrically connect the first electrode and the third pad, the fourth connection electrode piercing the insulating support layer in the first direction.