Methods for forming feedthroughs for hermetically sealed housings using powder injection molding
AssigneeSaluda Medical Pty Ltd
InventorsJohn L. Parker, David Robinson, David Thomas, Mark Fretz
Life of this patent
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Abstract
Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.
Claims22
A method of forming a plurality of feedthroughs comprising:
- positioning a plurality of separate electrically conductive elements in a mold;
- injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements;
- sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements;
- and
- severing each of the conductive elements between adjacent insulative bodies to form a plurality of physically separated feedthroughs, wherein each of the physically separated feedthroughs comprises one of the insulative bodies and a plurality of conductors.
A method of forming a feed through comprising:
- positioning a plurality of separate electrically conductive elements in a mold;
- injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form at least one container around the conductive elements;
- and
- sintering the container to form the feedthrough, wherein the feedthrough is unitary with at least one wall of the container.
A method of forming a feed through using a mold that defines at least one cavity when closed, the mold including one or more cores configured to move in an out of the mold cavity, the method comprising:
- moving the one or more cores into the mold cavity when the mold is closed;
- injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold cavity to form an insulative body around a portion of each of the one or more cores;
- removing each of the one or more cores from the mold cavity to form one or more core cavities in the insulative body;
- inserting one or more conductors into the one or more core cavities, respectively, as the insulative body cools;
- and
- sintering the insulative body, after said inserting the one or more conductors, to form the feedthrough.
Dependencies are inferred from the claim text.