Thermal flow sensor integrated circuit with low response time and high sensitivity

A thermal flow sensor device for sensing a flow in a fluid channel based on temperature measurements, the device comprising:

• an electrically driven thermal element on a front side of the thermal flow sensor device arranged to face the channel,
• a bond pad coupled electrically through physical contact with a channel facing side of the electrically driven thermal element and configured to facilitate electrical contact with a printed circuit board of the thermal flow sensor device via a surface of the bond pad that faces away from the channel and is accessible for electrical contact with the printed circuit board of the thermal flow sensor device;
• and
• a substrate, the substrate being patterned to provide apertures to expose the bond pad and increase sensitivity of the electrically driven thermal element such that a location of the physical contact between the bond pad and the electrically driven thermal element corresponds to a first aperture in the substrate and electrical contact between the bond pad and the printed circuit board is made via a second aperture in the substrate.