Method for forming a conductive pattern
AssigneeEastman Kodak Company
InventorIsrael Schuster
Life of this patent
Estimating the term…
Abstract
A method for forming a conductive pattern on a substrate (208) includes providing an image pattern for imaging on the substrate; imaging the image pattern on the substrate creating imaged areas; spraying functional material (240) on the substrate that diffuse molecules of the functional material into the imaged areas and wherein the functional material is in a form of liquid; and applying electro-less copper coating that builds conductive material traces on the imaged areas on the substrate.
Claims5
A method for forming a conductive pattern on a substrate comprising:
- providing an image pattern for imaging on said substrate;
- imaging said image pattern on said substrate creating imaged areas;
- spraying functional material on said substrate that diffuse molecules of said functional material into said imaged areas and wherein said functional material is in a form of liquid;
- and
- applying electro-less copper coating that build conductive material traces on said imaged areas on said substrate.
A method for forming a conductive pattern on a substrate comprising:
- providing an image pattern for imaging on said substrate;
- imaging said image pattern on said substrate creating imaged areas;
- spraying functional material on said substrate that diffuse molecules of said functional material into said imaged areas and wherein said functional material is in a form of liquid;
- applying electro-less copper coating that build conductive material traces on said imaged areas on said substrate;
- and
- wherein said functional material is applied after said imaging.
Dependencies are inferred from the claim text.