Stacked-type multilayer ceramic electronic component, stacked-type multilayer ceramic electronic component module, and method of manufacturing the same

A stacked-type multilayer ceramic electronic component module comprising:

• a printed circuit board (PCB) having first and second electrode pads formed on an upper surface thereof;
• first and second metal frames installed on the first and second electrode pads and electrically connected thereto, respectively;
• and
• two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween,
• wherein each of the ceramic bodies includes a ceramic element in which a plurality of dielectric layers are laminated, a plurality of first and second internal electrodes formed on one surfaces of the dielectric layers and alternately exposed to both surfaces of the ceramic element opposing one another in a lamination direction of the dielectric layers, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another, electrically connected to exposed portions of the first and second internal electrodes, and attached to the first and second metal frames, respectively,
• wherein the respective ceramic bodies have different levels of capacitance.

A method for manufacturing a stacked-type multilayer ceramic electronic component module, the method comprising:

• preparing a plurality of ceramic elements having a plurality of dielectric layers and a plurality of internal electrodes alternately exposed to both end surfaces thereof opposing one another, the ceramic elements having different amounts of laminated internal electrodes to have different levels of capacitance;
• forming first and second external electrodes electrically connected to the exposed portions of the internal electrodes on both end surfaces of the respective ceramic elements to prepare a plurality of ceramic bodies;
• disposing first and second flat plate type metal frames such that they face one another in parallel, disposing the plurality of ceramic bodies between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and subsequently attaching the first and second external electrodes of the ceramic bodies to the first and second metal frames to fabricate stacked-type multilayer ceramic electronic components;
• and
• attaching lower end portions of the first and second metal frames to first and second electrode pads provided on a PCB by solders so as to be electrically connected thereto.

A method for manufacturing a stacked-type multilayer ceramic electronic component module, the method comprising:

• preparing a first ceramic element having a plurality of dielectric layers and a plurality of internal electrodes alternately exposed to both end surfaces thereof opposing one another and a second ceramic element having a plurality of dielectric layers and a plurality of internal electrodes alternately exposed to both lateral surfaces thereof opposing one another, the first and second ceramic elements having different amounts of laminated internal electrodes to have different levels of capacitance;
• forming first and second external electrodes electrically connected to the exposed portions of the internal electrodes on both end surfaces of the first ceramic element and forming first and second external electrodes electrically connected to the exposed portions of the internal electrodes on both lateral surfaces of the second ceramic element to prepare first and second ceramic bodies;
• disposing first and second metal frames formed to be bent to have an ‘L’ shape such that they face one another diagonally, disposing the first and second ceramic bodies between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and subsequently attaching diagonally opposing portions of the first and second external electrodes of the first and second ceramic bodies to the bent portions of the first and second metal frames to fabricate stacked-type multilayer ceramic electronic components;
• and
• attaching lower end portions of the first and second metal frames to first and second electrode pads provided on a PCB by solders so as to be electrically connected thereto.