Conductive layer integrated FPC
AssigneeKaneka Corporation
InventorsMasayoshi Kido, Yoshihide Sekito
Life of this patent
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Abstract
A conductive-layer-integrated flexible printed circuit includes: (A) an electromagnetic-shielding conductive layer; (B) a photosensitive resin composition layer; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the photosensitive resin composition layer, and (C) the a wiring-pattern-equipped film being laminated in this order, and (B) the photosensitive resin composition layer being formed from a photosensitive resin composition containing at least (a) carboxyl-group-containing resin, (b) a photo-polymerization initiator, and (c) thermosetting resin.
Claims5
A conductive-layer-integrated flexible printed circuit board, comprising:
- (A) electromagnetic-shielding conductive layer;
- (B) a photosensitive resin composition layer;
- and
- (C) a wiring-pattern-equipped film;
- wherein the photosensitive composition layer is formed on or above the wiring-pattern-equipped film and the electromagnetic-shielding conductive layer is formed on or above the photosensitive composition layer;
- and
- the photosensitive resin composition layer is formed from a photosensitive resin composition containing at least (a) carboxyl-group-containing resin, (b) a photo-polymerization initiator, and (c) thermosetting resin.
Dependencies are inferred from the claim text.