High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorTakanori Uejima
Life of this patent
Estimating the term…
Abstract
A high-frequency module has a structure including balanced terminals, with high design flexibility and good transmission characteristics. Wiring patterns to be connected to balanced terminals of SAW filters of SAW duplexers are located on a second layer to a sixth layer of a layered body. The characteristic impedances of first wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of second wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of third wiring patterns defining a pair of parallel or substantially parallel lines match, and the characteristic impedances of fourth wiring patterns defining a pair of parallel or substantially parallel lines match.
Claims19
A high-frequency module comprising:
- a high-frequency device including balanced terminals;
- and
- a layered body having the high-frequency device mounted thereon and including balanced-output external connection ports to be connected to the balanced terminals;
- wherein
- the layered body includes a first routing pattern and a second routing pattern that connect the balanced terminals and the balanced-output external connection ports to each other;
- the first routing pattern and the second routing pattern have shapes such that characteristic impedances thereof are the same;
- the layered body includes a plurality of layers, each of the plurality of layers includes an upper principal surface and a lower principal surface, and the upper principal surface of an uppermost one of the plurality of layers defines a mounting surface on which the high-frequency device is mounted;
- electrode patterns defining circuit elements and wiring patterns, which constitute the high-frequency module, are located on the upper principal surface of at least one of the plurality of layers;
- the first routing pattern and the second routing pattern are located between the mounting surface and a first inner layer ground electrode located in the layered body;
- a position at which the first routing pattern and the second routing pattern are located overlaps a position at which the electrode patterns defining the circuit elements and the wiring patterns are located when the high-frequency device is viewed in a plan view;
- and
- the first inner layer ground electrode located in the layered body is located between the electrode patterns defining the circuit elements and the wiring patterns, and the first routing pattern and the second routing pattern in a thickness direction of the high frequency device.
Dependencies are inferred from the claim text.