Integrated millimeter wave transceiver
AssigneesSTMicroelectronics (Crolles 2) SAS, Commissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsJean-François Carpentier, Laurent Dussopt, Henri Sibuet
Life of this patent
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Abstract
A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on an electronic device; at least one integrated circuit chip assembled on the upper surface of the interposer; at least one antenna including at least one track formed on the upper surface of the interposer; and at least one block attached under the plate and including in front of each antenna a cavity having a metalized bottom, the distance between each antenna and the bottom being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.
Claims19
A millimeter wave transceiver comprising:
- an interposer plate having an upper surface and a lower surface;
- an integrated circuit chip positioned on the upper surface of the interposer;
- an antenna that includes a track formed on the upper surface of the interposer, the antenna being configured to transmit a millimeter wave signal from the integrated circuit chip;
- a block attached to the lower surface of the interposer plate and including a cavity directly under the antenna;
- and
- a metal layer covering a bottom of the cavity, the metal layer being separated from the antenna by a distance on the order of one quarter of a wavelength of the signal and being configured to reflect the signal back towards the antenna.
An electronic device, comprising:
- a printed circuit board;
- and
- a millimeter wave transceiver coupled to the printed circuit board and including:
- an interposer plate having an upper surface and a lower surface;
- an integrated circuit chip assembled on the upper surface of the interposer;
- an antenna that includes a track formed on the upper surface of the interposer, the antenna being configured to transmit a millimeter wave signal from the integrated circuit chip;
- a block attached the lower surface of the interposer plate and including a cavity directly under the antenna;
- and
- a metal layer covering a bottom of the cavity, the metal layer being separated from the antenna by a distance on the order of one quarter of a wavelength of the signal and being configured to reflect the signal back towards the antenna.
A millimeter wave transceiver comprising:
- an interposer plate having an upper surface and a lower surface;
- an integrated circuit chip positioned on the upper surface of the interposer;
- a plurality of antennas respectively including a plurality of tracks formed on the upper surface of the interposer, the antennas being configured to transmit a millimeter wave signal from the integrated circuit chip;
- a block attached to the lower surface of the interposer plate and including a plurality of cavities, each cavity being directly under a corresponding one of the antennas and including a bottom;
- and
- a plurality of metal portions respectively covering the bottoms of the cavities, the metal portions being separated from the antennas by a distance on the order of one quarter of a wavelength of the signal and being configured to reflect the signal back towards the antennas.
Dependencies are inferred from the claim text.