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US 9,070,938 B2Granted
Terminal lead
AssigneeShowa Denko Packaging Co., Ltd.
InventorsDaisuke Hashimoto, Takurou Watanabe, Keiichi Yokoi, Hiroshi Hata
Life of this patent
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AssigneeShowa Denko Packaging Co., Ltd.
InventorsDaisuke Hashimoto, Takurou Watanabe, Keiichi Yokoi, Hiroshi Hata
Estimating the term…
A terminal lead 1 includes an inner end portion 1a to be arranged inwardly of an exterior casing 9 which accommodates an electrochemistry element 6, an outer end portion 1b to be arranged outwardly of the exterior casing 9, and a plate-shaped metallic substrate 2 as a base material. An insulating resin film 4 is arranged at a portion of the terminal lead 1 corresponding to a seal portion 9x of the exterior casing 9. In this terminal lead 1, a surface coating layer 3 is formed on both surfaces 2p and 2p of the metallic substrate 2 in a thickness direction thereof. A coated amount of both widthwise end portions 3a and 3a of the surface coating layer 3 formed on both surfaces 2p and 2p of the metallic substrate 2 in the thickness direction is less than that a widthwise intermediate portion 3b thereof.
A terminal lead comprising:
A production method of a terminal lead including an inner end portion to be arranged inwardly of an exterior casing which accommodates an electrochemical element, an outer end portion to be arranged outwardly of the exterior casing, a plate-shaped metallic substrate as a base material, and an insulating resin film to be arranged at a portion of the metallic substrate corresponding to a seal portion of the exterior casing, the method comprising the steps of:
Dependencies are inferred from the claim text.