OLED package and packaging method thereof

#This application claims the priority benefit of Chinese Patent Application Number 201210088176.8, filed on Mar. 19, 2012, the full disclosure of which is incorporated herein by reference.

#1. Field of the Disclosure

#This disclosure generally relates to an organic light emitting diode (OLED) structure and, more particularly, to an OLED package and a packaging method thereof.

#Other objects, advantages, and novel features of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

#FIGS. 1A-1C show schematic diagrams of conventional OLED packages.

#FIG. 2 shows a schematic diagram of the OLED package according to a first embodiment of the present disclosure.

#It should be noted that, wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

#Referring to FIG. 2, it shows a schematic diagram of the organic light emitting diode (OLED) package according to a first embodiment of the present disclosure. The OLED package 1 includes a substrate 11, a lighting component 12, an organic buffer layer 13, a compound barrier layer 14, a moisture absorption zone 15 and an inorganic barrier layer 16.

#The lighting component 12 is an OLED device and formed on the substrate 11. It is appreciated that the lighting component 12 generally has two electrodes (i.e. anode and cathode) and an organic emitting layer sandwiched between the two electrodes. The two electrodes and the organic emitting layer are sequentially formed on the substrate 11 by, for example vapor deposition or coating, wherein the structure and the manufacturing method of the lighting component 12 are well known to the art and thus details thereof are not described herein.