OLED display having organic and inorganic encapsulation layers, and manufacturing method thereof

An organic light emitting diode (OLED) display comprising:

• a substrate;
• an organic light emitting element on the substrate and comprising a first electrode, a light emission layer, and a second electrode;
• and
• an encapsulation layer on the substrate while covering the organic light emitting element,
• wherein the encapsulation layer comprises an organic layer and an inorganic layer,
• wherein a mixed area, where organic materials forming the organic layer and inorganic materials forming the inorganic layer co-exist along a plane direction of the encapsulation layer, is formed at the boundary between the organic layer and the inorganic layer, and
• wherein the organic layer has a plurality of holes, and the inorganic layer is formed on the organic layer while concurrently filling the plurality of holes.

A manufacturing method of an organic light emitting diode (OLED) display, the method comprising:

• forming an organic light emitting element to include a first electrode, a light emission layer, and a second electrode on a substrate;
• and
• forming an encapsulation layer on the organic light emitting element,
• wherein the forming of the encapsulation layer comprises,
• forming an organic layer to include a plurality of organic materials and a plurality of etching target particles;
• forming a plurality of groove portions in the organic layer by selectively etching the etching target particles;
• and
• filling the plurality of groove portions with inorganic materials by forming an inorganic layer on the organic layer.

A manufacturing method of an organic light emitting diode (OLED) display, the method comprising:

• forming an organic light emitting element to include a first electrode, a light emission layer, and a second electrode on a substrate;
• and
• forming an encapsulation layer on the organic light emitting element,
• wherein the forming of the encapsulation layer comprises,
• forming an organic layer to include organic materials and etching target particles;
• forming a plurality of holes in the organic layer by selectively etching the etching target particles;
• and
• filling the plurality of holes with inorganic materials by forming an inorganic layer on the organic layer.