US 9,070,845 B2 · Optical semiconductor lighting apparatus

Abstract

An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.

Claims9

Dependent claims

An optical semiconductor lighting apparatus, comprising:

a substrate;
a plurality of LED chips disposed in the substrate;
a first mold portion disposed on the substrate to cover the plurality of LED chips;
and
a second mold portion extending from an edge of the first mold portion and connecting the first mold portion,
wherein the first mold portion comprises:
a transparent or translucent resin;
and
a particle-shape fluorescent material mixed with the resin;
and
the particle-shape fluorescent material is disposed only on surfaces of the LED chips and around the LED chips, and is not mixed with an upper portion of the first mold portion.

8 more elements

Dependencies are inferred from the claim text.

Optical semiconductor lighting apparatus

Life of this patent

Optical semiconductor lighting apparatus

Life of this patent

Abstract

Claims9