Light-emitting diode manufacturing method
AssigneeZhongshan Innocloud Intellectual Property Services Co., Ltd.
InventorsPin-Chuan Chen, Lung-Hsin Chen
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Abstract
A light-emitting diode manufacturing method comprises steps of: providing a flexible material layer having a flexible reflective layer and phosphor glue in the flexible reflective layer; providing a hard material layer having a substrate and an LED chip on the substrate; combining the flexible material layer and the hard material layer together wherein the LED chip inserts into the phosphor glue and is surrounded by the flexible reflective layer; and solidifying the flexible reflective layer and the phosphor glue to form a reflective cup and a phosphor layer, respectively.
Claims10
A light-emitting diode manufacturing method, comprising the steps of:
- providing a flexible layer, wherein the flexible material layer comprises a flexible reflective layer and phosphor glue;
- providing a hard material layer, wherein the hard material layer comprises a substrate and at least one chip set on the substrate;
- combining the flexible material layer an the hard material layer, wherein the at least one chip is brought to insert into the phosphor glue, the flexible reflective layer is extruded to connect with the substrate;
- and
- solidifying the flexible reflective layer and the phosphor glue to form at least one reflective cup surrounding the at least one chip and a phosphor layer receiving the at least one chip therein.
Dependencies are inferred from the claim text.