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US 9,070,829 B2Granted
Light emitting diode chip and method for manufacturing the same
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsYa-Wen Lin, Ching-Hsueh Chiu, Po-Min Tu, Shih-Cheng Huang
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Abstract
An LED package includes a substrate, a buffer layer formed on the substrate, an epitaxial structure formed on the buffer layer, and a plurality of carbon nanotube bundles formed in the epitaxial structure.
Claims11
An LED (light emitting diode) chip, comprising:
- a substrate;
- a buffer layer formed on the substrate;
- an epitaxial structure formed on the buffer layer;
- and
- a plurality of carbon nanotube bundles formed in the epitaxial structure;
- wherein the carbon nanotube bundles are arranged radially, and each carbon nanotube bundle is intersected with others at an edge thereof.
3 more elements
Dependencies are inferred from the claim text.