Photonic device
AssigneeSamsung Electronics Co., Ltd.
InventorsKwang-hyun Lee, Dong-jae Shin, Ho-chul Ji
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AssigneeSamsung Electronics Co., Ltd.
InventorsKwang-hyun Lee, Dong-jae Shin, Ho-chul Ji
Estimating the term…
A photonic device is provided. The photonic device includes: a semiconductor layer including first and second regions; an insulating layer covering the semiconductor layer; and first and second plugs extending to pass through the insulating layer and electrically connected to the corresponding first and second regions. The first plug is in a rectifying contact with the first region, and the second plug is in an ohmic contact with the second region.
A photonic device comprising:
A system, comprising:
A method, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
The devices having only one potential barrier, e.g. photodiodes: the potential barrier being a PIN barrier
For the control of the intensity, phase, polarisation or colour: based on semiconductor elements having potential barriers, e.g. having a PN or…
Based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction: in an optical waveguide structure
In an optical waveguide structure: the optical waveguides being made of semiconducting material
About 6 years 8 months of term left · ends 6 Jul 2033 (estimated)
This application claims the benefit of Korean Patent Application No. 10-2012-0092543, filed on Aug. 23, 2012, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
Embodiments relate to a photonic device, and more particularly, to a photonic device that is suitable for higher-speed operation and is easily manufactured.
Due to increasing demands for higher integration and large capacity electronic devices and increased use of multimedia information, photonic integrated circuits (PIC) using optical interconnections for communication between various components within a system are being used in a wide range of applications. A PIC conveys information as optical signals rather than electrical signals and includes a photonic device, such as an electro-optic modulator for converting an electrical signal to an optical signal, and a photonic device such as an optical receiver for converting an optical signal into an electrical signal. The electro-optic modulator and the optical receiver generally use diode-type electrodes to convert an electrical signal to an optical signal and vice versa.
Exemplary embodiments of the inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic block diagram of an electro-optic modulator including a phase shift unit used as a photonic device according to an embodiment of the present invention;
FIG. 2 is a detailed perspective view of the electro-optic modulator of FIG. 1 according to an embodiment of the present invention;
Example embodiments of the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, the exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The scope of the present invention is defined only by the appended claims. Like numbers refer to like elements throughout.
The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” or “includes” and/or “including” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements that may be present. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.