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US 9,070,787 B2Granted
Package-on-package assembly and method
AssigneeIntel Corporation
InventorsAmir Wagiman, Thor Soo Fung, Fong Chin Yee
Life of this patent
Estimating the term…
Abstract
A package-on-package (PoP) assembly is provided. The package-on-package (PoP) assembly includes a first integrated circuit package and an anisotropic conductive film (ACF) disposed on a top surface of the first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles. The package-on-package (PoP) assembly also includes a second integrated circuit package disposed on a top surface of the anisotropic conductive film.
Claims13
A method of forming a package-on-package assembly, comprising:
- laminating an anisotropic conductive film on a top surface of a first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles disposed within the anisotropic conductive film;
- disposing a second integrated circuit package on a top surface of the anisotropic conductive film;
- and
- bonding the first and second integrated circuit packages to align the plurality of conductive particles between the first and second integrated circuit package, wherein bonding the first and second integrated circuit packages comprises bonding the plurality of conductive particles to a solder paste disposed on a plurality of locations on the second integrated circuit package.
1 more element
A method of forming a package-on-package assembly, comprising:
- laminating an anisotropic conductive film on a top surface of a first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles disposed within the anisotropic conductive film;
- disposing a second integrated circuit package on a top surface of the anisotropic conductive film;
- and
- bonding the first and second integrated circuit packages to align the plurality of conductive particles between the first and second integrated circuit package;
- wherein laminating the anisotropic conductive film on the top surface of the first integrated circuit package comprises laminating the anisotropic conductive film on the top surface of the first integrated circuit package that includes a plurality of copper pads disposed on the top surface thereof;
- and wherein disposing the second integrated circuit package on the anisotropic conductive film top surface comprises disposing the second integrated circuit package having solder disposed in a plurality of locations on the top surface thereof corresponding to the plurality of copper pads disposed on the top surface of the first integrated circuit package.
3 more elements
Dependencies are inferred from the claim text.