Heterojunction bipolar transistors with reduced parasitic capacitance
AssigneeInternational Business Machines Corporation
InventorsRenata Camillo-Castillo, Vibhor Jain, Vikas K. Kaushal, Marwan H. Khater
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AssigneeInternational Business Machines Corporation
InventorsRenata Camillo-Castillo, Vibhor Jain, Vikas K. Kaushal, Marwan H. Khater
Estimating the term…
Fabrication methods, device structures, and design structures for a heterojunction bipolar transistor. A trench isolation region and a collector are formed in a semiconductor substrate. The collector is coextensive with the trench isolation region. A first semiconductor layer is formed that includes a of single crystal section disposed on the collector and on the trench isolation region. A second semiconductor layer is formed that includes a single crystal section disposed on the single crystal section of the first semiconductor layer and that has an outer edge that overlies the trench isolation region. The section of the first semiconductor layer has a second width greater than a first width of the collector. The section of the second semiconductor layer has a third width greater than the second width. A cavity extends laterally from the outer edge of section of the second semiconductor layer to the section of the first semiconductor layer.
A device structure for a heterojunction bipolar transistor, the device structure formed using a semiconductor substrate, the device structure comprising:
A design structure readable by a machine used in design, manufacture, or simulation of an integrated circuit, the design structure comprising:
Dependencies are inferred from the claim text.