Method of lowering temperature of substrate table, computer-readable storage medium, and substrate processing system

A computer-readable storage medium storing a control program executable on a computer,

• the control program being configured to control a semiconductor substrate processing system so as to carry out a method of lowering a temperature of a substrate table by the computer, the substrate processing system including:
• a first substrate table provided with a heating mechanism for heating a semiconductor substrate;
• a processing chamber in which the first substrate table is disposed, the processing chamber being configured to perform a predetermined process with the substrate being placed on the first substrate table;
• a temperature sensor configured to determine a temperature of the first substrate table;
• a substrate transfer apparatus configured to transfer the substrate to the processing chamber;
• a transfer chamber in which the substrate transfer apparatus is disposed;
• a second substrate table configured to cool the substrate;
• and a controller configured to control the semiconductor substrate processing system,
• the method of lowering a temperature of a substrate table comprising the steps of:
• determining a temperature of the first substrate table by use of the temperature sensor,
• a first transfer controlled by the controller in which the substrate placed on the first substrate table is transferred to the second substrate table by the substrate transfer apparatus;
• a second transfer controlled by the controller in which the substrate placed on the second substrate table and cooled to another substrate temperature by the second substrate table is transferred to and placed on the first substrate table by the substrate transfer apparatus;
• and
• repeating the step of first transfer, the step of second transfer, and the determining step until the temperature of the first substrate table is lowered to a predetermined temperature by transferring heat from the first substrate table to the substrate.

A semiconductor substrate processing system comprising:

• a first substrate table provided with a heating mechanism for heating a semiconductor substrate;
• at least one processing chamber in which the first substrate table is disposed, the processing chamber being configured to perform a predetermined process with the substrate being placed on the first substrate table;
• a temperature sensor configured to determine a temperature of the first substrate table;
• a substrate transfer apparatus configured to transfer the substrate to the processing chamber;
• a transfer chamber in which the substrate transfer apparatus is disposed;
• a second substrate table configured to cool the substrate;
• and
• a controller configured to control the semiconductor substrate processing system, the controller:
• determining a temperature of the first substrate table by use of the temperature sensor,
• causing a first transfer in which the substrate placed on the first substrate table and heated by the first substrate table to a substrate temperature is transferred to and placed on the second substrate table by the substrate transfer apparatus,
• causing a second transfer in which the substrate placed on the second substrate table and cooled to another substrate temperature by the second substrate table is transferred to and placed on the first substrate table by the substrate transfer apparatus, and
• causing the first transfer, the second transfer, and the temperature determining to be repeated until the temperature of the first substrate table is lowered to a predetermined temperature by transferring heat from the first substrate table to the substrate.