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US 9,070,721 B2Granted
Semiconductor devices and methods of making the same
AssigneeSemiconductor Components Industries, LLC
InventorsRoger M. Arbuthnot, Stephen St. Germain
Life of this patent
Estimating the term…
Abstract
In one embodiment, methods for making semiconductor devices are disclosed.
Claims17
A semiconductor device comprising:
- a first conductive substrate electrically coupled to a first lead, wherein the first conductive substrate comprises two or more elevated regions on a first side of the first conductive substrate, wherein each of the elevated regions comprises a planar surface on the first side of the first conductive substrate;
- a semiconductor die comprising one or more first contact pads, a second contact pad, and a third contact pad, wherein the first contact pads are disposed on a first side of the semiconductor die, and wherein each of the first contact pads are soldered to at least one of the elevated regions such that each of the first contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions, and wherein at least one of the first contact pads is soldered to two or more of the elevated regions;
- a second lead electrically coupled to the second contact pad of the semiconductor die;
- and
- a third lead electrically coupled to the third contact pad of the semiconductor die.
2 more elements
A semiconductor device comprising:
- a lead frame comprising a first contact electrically coupled to a first lead of the semiconductor device;
- a conductive clip electrically coupled to a second lead on the semiconductor device, wherein the conductive clip comprises two or more elevated regions on a first side of the conductive clip, wherein each of the elevated regions comprises a planar surface on the first side of the conductive clip;
- and
- a semiconductor die comprising:
- a first contact pad on a first side of the semiconductor die, wherein the first contact pad is soldered to the first contact on the lead frame;
- one or more second contact pads on a second a side of the semiconductor die, wherein each of the second contact pads are soldered to at least one of the elevated regions on the first side of the conductive clip such that each of the second contacts pads has two or more linear edges that are each laterally aligned and parallel with at least one edge of the planar surfaces on the elevated regions, and wherein at least one of the second contact pads is soldered to two or more of the elevated regions;
- and
- a third contact pad on the semiconductor die, wherein the third contact pad is electrically coupled to a third lead of the semiconductor device.
5 more elements
Dependencies are inferred from the claim text.