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US 9,070,696 B2Granted
Semiconductor device manufacturing method and semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsKazunaga Onishi, Rikihiro Maruyama, Masafumi Tezuka, Masahiro Kikuchi
Life of this patent
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Abstract
In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.
Claims6
A semiconductor device, comprising:
- an insulating circuit substrate mounted with at least one semiconductor element;
- a resin case provided with a plurality of terminals having leg portions;
- and
- protrusion marks formed in vicinities of the leg portions of the plurality of terminals of the resin case,
- wherein the plurality of terminals and the resin case are integrally molded using a molding die, and the protrusion marks are marks where protrusions for fixing the plurality of terminals in predetermined positions in the molding die are placed.
2 more elements
Dependencies are inferred from the claim text.