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US 9,070,695 B2Granted
Integrated circuit with sensor and method of manufacturing such an integrated circuit
AssigneeNXP B.V.
InventorsRoel Daamen, Hendrik Bouman, Coenraad Cornelis Tak
Life of this patent
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Abstract
An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends, and it has a channel around the sensor element area to act as a trap for any encapsulation material which has crept into the opening area.
Claims14
An integrated circuit package, comprising:
- an integrated circuit having at least one sensor element in a sensor element area of the circuit;
- a carrier on which the integrated circuit is mounted;
- a plurality of bond wires between the integrated circuit and the carrier;
- an encapsulation which covers the bond wires and which leaves an opening over the sensor element area,
- wherein a protection layer is provided over the integrated circuit over which the encapsulation extends, wherein the protection layer comprises a channel around the sensor element area, which lies inside the opening of the encapsulation;
- and
- wherein the protection layer directly covers the at least one sensor element.
4 more elements
A method of forming an integrated circuit package, comprising:
- providing an integrated circuit having at least one sensor element in a sensor element area of the circuit;
- mounting the integrated circuit on a carrier;
- forming a plurality of bond wires between the integrated circuit and the carrier;
- forming an encapsulation layer to cover the bond wires and leave an opening over the sensor element area;
- forming a protection layer over the integrated circuit before mounting on the carrier;
- and
- forming a channel in the protection layer around the sensor element area,
- and wherein the forming of the encapsulation layer comprises molding the encapsulation layer up to a barrier formed as part of a mold, with the channel on an inner side of the barrier.
5 more elements
Dependencies are inferred from the claim text.