Semiconductor package and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorMin Gi Cho
Life of this patent
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Abstract
There are provided a semiconductor package and a manufacturing method thereof, capable of increasing integration by mounting electronic devices on both surfaces of a substrate. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities.
Claims18
A semiconductor package, comprising:
- a first substrate having mounting electrodes fowled on both surfaces thereof;
- a plurality of electronic devices mounted on both surfaces of the first substrate;
- a second substrate bonded to a bottom surface of the first substrate;
- and
- an insulating layer interposed between the first substrate and the second substrate,
- wherein the bottom surface of the first substrate is divided into an insulating region in which the insulating layer is disposed and a mounting region in which the electronic devices are mounted, and
- a blocking part is disposed between the insulating region and the mounting region to block a movement of the insulating layer.
A semiconductor package, comprising:
- a first substrate having mounting electrodes formed on both surfaces thereof;
- a plurality of electronic devices mounted on both surfaces of the first substrate;
- a second substrate bonded to a bottom surface of the first substrate;
- and
- an insulating layer interposed between the first substrate and the second substrate, wherein the bottom surface of the first substrate has a blocking part keeping the insulating layer from moving into a mounting region in which the electronic devices are mounted.
Dependencies are inferred from the claim text.