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AssigneeAvalanche Technology, Inc.
InventorsYuchen Zhou, Bernardo Sardinha, Rajiv Yadav Ranjan, Ebrahim Abedifard, Roger Klas Malmhall, Zihui Wang, Yiming Huai, Jing Zhang
Estimating the term…
Chip packages are described with soft-magnetic shields that are included inside or attached externally to the package containing a MRAM chip. In one group of embodiments a single shield with vias for bonding wires is affixed to the surface of the MRAM chip having the contact pads. The limitation of shield to chip distance due to bonding wire is eliminated by VIA holes according to the invention which achieves minimal spacing between the shield and chip. A second shield without vias can be positioned on the opposite side of the chip from the first shield. In one group of embodiments a hardened ferro-fluid shield can be the only shield or the structure can include a shield with or without vias. One group of embodiments includes an external shield with vias for solder access to the package contact pads affixed to the outer surface of the package.
A chip package including:
A chip package including:
A chip package including:
A chip package including:
Dependencies are inferred from the claim text.