Semiconductor device packaging having plurality of wires bonding to a leadframe
AssigneeRohm Co., Ltd.
InventorHiroyuki Kaneda
Life of this patent
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Abstract
A semiconductor device includes a semiconductor element, a lead, and a wire including a first bonding portion bonded to the semiconductor element and a second bonding portion bonded to the lead. The semiconductor element includes a first bonding surface which faces to a first side in a first direction and to which the first bonding portion is bonded. The lead includes a second bonding surface and a third bonding surface both facing to the first side in the first direction and forming an angle larger than 180° on the first side in the first direction. The semiconductor device further includes a ball bump extending onto both the second bonding surface and the third bonding surface. The second bonding portion is bonded to the lead via the ball bump.
Claims19
A semiconductor device comprising:
- a semiconductor element;
- a lead;
- and
- a wire including a first bonding portion bonded to the semiconductor element, a second bonding portion bonded to the lead and a bridge portion connecting the first bonding portion and the second bonding portion to each other;
- wherein,
- the semiconductor element includes a first bonding surface, the first bonding portion being bonded to the first bonding surface,
- the lead includes a second bonding surface and a third bonding surface forming an angle larger than 180° at an outside of the lead,
- the second bonding surface and the third bonding surface are is provided with a ball bump extending on both the second and the third bonding surfaces,
- the second bonding portion is bonded to the lead via the ball bump,
- the bridge portion of the wire includes an elongated section connected to the second bonding portion, and
- the second bonding surface lies between the third bonding surface and the position of the semiconductor element in a direction along which the elongated section of the bridge portion extends as viewed in a normal direction relative to the first bonding surface.
Dependencies are inferred from the claim text.