Bowl-shaped solder structure
AssigneeInvensas Corporation
InventorsCyprian Emeka Uzoh, Rajesh Katkar
Life of this patent
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Abstract
An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process.
Claims13
An apparatus, comprising:
- a substrate;
- a first metal layer on the substrate, the first metal layer having an opening, the opening of the first metal layer having a bottom and one or more sides extending from the bottom;
- a second metal layer on the first metal layer;
- the first metal layer and the second metal layer providing a bowl-shaped structure, an inner surface of the bowl-shaped structure defined responsive to the opening of the first metal layer and the second metal layer thereon;
- the opening of the bowl-shaped structure being configured to receive and at least partially retain bonding material during reflow processing;
- and
- the bottom of the bowl-shaped structure having a contour including a recess and a post, the post being a portion of the first metal layer defined by the recess around the post.
An apparatus, comprising:
- a substrate;
- a first metal layer and a polymer layer on the substrate;
- a second metal layer on the first metal layer and extending along a portion of the polymer layer disposed above the first metal layer;
- the first metal layer, the second metal layer and the polymer layer in combination providing a bowl-shaped structure, the second metal layer providing an inner surface of the bowl-shaped structure, the polymer layer providing one or more sides of the bowl-shaped structure with the one or more sides extending from the substrate, the first metal layer disposed between the substrate and the polymer layer providing a bottom of the bowl-shaped structure on which the second metal layer is plated, the portion of the polymer layer having the second metal layer extending along thereof being included in the one or more sides of the bowl-shaped structure;
- the bowl-shaped structure defining an opening;
- and
- the opening of the bowl-shaped structure being configured to receive and at least partially retain bonding material during reflow processing.
Dependencies are inferred from the claim text.