Electrical connectivity of die to a host substrate
AssigneeInternational Rectifier Corporation
InventorRobert T. Carroll
Life of this patent
Estimating the term…
Abstract
According to example configurations herein, an apparatus comprises a die and a host substrate. The die can include a first transistor and a second transistor. A surface of the die includes multiple conductive elements disposed thereon. The multiple conductive elements on the surface are electrically coupled to respective nodes of the first transistor and the second transistor. Prior to assembly, the first transistor and second transistor are electrically isolated from each other. During assembly, the surface of the die including the respective conductive elements is mounted on a facing of the host substrate. Accordingly, a die including multiple independent transistors can be flipped and mounted to a respective host substrate such as printed circuit board, lead frame, etc.
Claims24
An apparatus comprising:
- a die comprising:
- a first transistor,
- a second transistor, and
- a surface including multiple conductive elements thereon, the multiple conductive elements on the surface electrically coupled to respective nodes of the first transistor and the second transistor;
- a host substrate, the surface of the die mounted on a facing of the host substrate;
- wherein the first transistor is a control switch of a switching power supply circuit and the second transistor is a synchronous switch in the switching power supply circuit.
An apparatus comprising:
- a die comprising:
- a first transistor,
- a second transistor, and
- a surface including multiple conductive elements thereon, the multiple conductive elements on the surface electrically coupled to respective nodes of the first transistor and the second transistor;
- and
- a host substrate, the surface of the die mounted on a facing of the host substrate;
- wherein the multiple conductive elements includes:
- a first conductive element, the first conductive element electrically coupled to a respective source region of the first transistor;
- a second conductive element, the second conductive element coupled to a respective drain region of the first transistor;
- a third conductive element, the third conductive element disposed over a respective gate region of the first transistor;
- a fourth conductive element, the fourth conductive element coupled to a respective source region of the second transistor;
- a fifth conductive element, the fifth conductive element coupled to a respective drain region of the second transistor;
- and
- a sixth conductive element, the sixth conductive element disposed over a respective gate region of the second transistor.
A method comprising:
- receiving a die, the die comprising:
- a first transistor,
- a second transistor, and
- a surface including multiple conductive elements thereon, the multiple conductive elements on the surface electrically coupled to respective nodes of the first transistor and the second transistor;
- mounting a surface of the die to a facing of the host substrate;
- and
- wherein the first transistor is a control switch of a switching power supply circuit and the second transistor is a synchronous switch in the switching power supply circuit.
Dependencies are inferred from the claim text.