Heat conductive substrate for integrated circuit package

An integrated circuit package assembly comprising:

• a first substrate having a first portion and a second portion integrally formed with the first portion, wherein the second portion is thicker in dimension than the first portion;
• a first integrated circuit die mounted to a first side of the first portion of the first substrate;
• and
• a second integrated circuit die mounted to a second side of the first portion of the first substrate, wherein a first active side of the first integrated circuit die faces towards the first side of the first portion, and wherein a second active side of the second integrated circuit die faces towards the second side of the first portion, wherein the first and second active sides are facing towards each other,
• the integrated circuit package assembly further comprising:
• a package assembly substrate having electrical circuit traces thereon;
• and
• electrical contacts interfacing between electrical contact pads on the second integrated circuit die and the electrical circuit traces suitable for communicating electrical signals between the electrical contact pads and the electrical circuit traces,
• wherein the first portion serves as a first heat conducting portion of the first substrate suitable for conducting heat generated by the first and second integrated circuit dies, and wherein the second portion serves as a first heat dissipating portion integrally formed with the first heat conducting portion, the first heat dissipating portion suitable for dissipating the heat conducted by the first heat conducting portion of the first substrate into an environment surrounding the integrated circuit package assembly.

An integrated circuit package assembly comprising:

• a first heat conducting interposer having a first heat conducting portion and a first heat dissipating portion integrally formed with the first heat conducting portion, wherein the first heat dissipating portion is thicker in dimension than the first heat conducting portion;
• a first flip-chip die affixed to a first side of the first heat conducting portion of the first heat conducting interposer, wherein the first flip-chip die includes a first active side having a first plurality of electrical interconnects for transferring electrical signals to and from circuitry within the first flip-chip die and circuitry external to the first flip-chip die;
• and
• a second flip-chip die affixed to a second side of the first heat conducting portion of the first heat conducting interposer, wherein the second flip-chip die includes a second active side having a second plurality of electrical interconnects for transferring electrical signals to and from circuitry within the second flip-chip die and circuitry external to the second flip-chip die, wherein the first and second flip-chip dies are affixed to the first and second sides of the first heat conducting portion so that the first active side of the first flip-chip die is facing the second active side of the second flip-chip die, wherein the first heat conducting portion of the first heat conducting interposer is configured for conducting heat generated by the first and second flip-chip dies to the first heat dissipating portion that is configured for dissipating the heat into an environment surrounding the integrated circuit package assembly, wherein the first heat dissipating portion is positioned externally from a location between the first and second flip-chip dies.