Underfill-accommodating heat spreaders and related semiconductor device assemblies and methods
AssigneeMicron Technology, Inc.
InventorsAndy E. Hooper, Xiao Li, Shijian Luo
Life of this patent
Estimating the term…
Abstract
Heat spreaders for dissipating heat from semiconductor devices comprise a contact surface located within a recess on an underside of the heat spreader, the contact surface being configured to physically and thermally attach to a semiconductor device, and a trench extending into the heat spreader adjacent to the contact surface sized and configured to receive underfill material extending from the semiconductor device into the trench. Related semiconductor device assemblies may include these heat spreaders and methods may include physically and thermally attaching these heat spreaders to semiconductor devices such that underfill material extends from a semiconductor device into the trench.
Claims20
A heat spreader for dissipating heat from a semiconductor device assembly, comprising:
- a contact surface located within a recess on an underside of the heat spreader, the contact surface being configured to physically and thermally attach to an adjacent semiconductor device;
- and
- a trench adjacent to the contact surface, the trench extending from the contact surface into the heat spreader toward a topside of the heat spreader, the trench being sized and configured to receive underfill material extending from the semiconductor device assembly above the adjacent semiconductor device into the trench.
A semiconductor device assembly, comprising:
- a heat spreader comprising:
- a contact surface located within a recess on an underside of the heat spreader;
- and
- a trench adjacent to the contact surface, the trench extending from the contact surface into the heat spreader toward a topside of the heat spreader;
- a semiconductor device received within the recess, a surface of the semiconductor device in physical and thermal contact with the contact surface;
- and
- underfill material extending laterally beyond a side of the semiconductor device, the underfill material extending at least partially into the trench.
A method of accommodating excess underfill material in a semiconductor device assembly, comprising:
- forming a trench in a heat spreader adjacent to a contact surface within a recess on an underside of the heat spreader, the trench extending from the contact surface into the heat spreader toward a topside of the heat spreader;
- positioning a semiconductor device within the recess;
- physically and thermally attaching the contact surface of the heat spreader to a surface of the semiconductor device;
- and
- inserting underfill material extending above the surface of the semiconductor device into the trench.
Dependencies are inferred from the claim text.