Methods for forming assemblies and multi-chip modules including stacked semiconductor dice

A method for forming an assembly including semiconductor devices in stacked arrangement, the method comprising:

• attaching a first semiconductor device including an active surface to a surface of a substrate;
• disposing a plurality of discrete spacers on the active surface of the first semiconductor device;
• extending a plurality of discrete conductive elements between a plurality of bond pads positioned in a central region of the active surface of the first semiconductor device and the substrate, comprising:
• extending the plurality of discrete conductive elements from the plurality of bond pads over the active surface of the first semiconductor device;
• extending a portion of the plurality of discrete conductive elements through a common aperture formed between two of the plurality of discrete spacers on a first side of the first semiconductor device;
• extending a remaining portion of the plurality of discrete conductive elements through another common aperture formed between two of the plurality of discrete spacers on a second, opposing side of the first semiconductor device;
• extending another plurality of discrete conductive elements from a plurality of peripherally located bond pads on the active surface of the first semiconductor device to the surface of the substrate, comprising:
• extending a portion of the another plurality of discrete conductive elements through a third common aperture formed between two of the plurality of discrete spacers on a third side of the first semiconductor device;
• extending a remaining portion of the another plurality of discrete conductive elements through a fourth common aperture formed between two of the plurality of discrete spacers on a fourth side of the first semiconductor device opposing the third side;
• positioning a second semiconductor device having a back side over the first semiconductor device;
• attaching the back side of the second semiconductor device to the plurality of discrete spacers;
• and
• electrically isolating the plurality of discrete conductive elements from the back side of the second semiconductor device.