Interposer package-on-package structure

A method of manufacturing an integrated circuit (IC) package, the method comprising:

• coupling a first plurality of electrical contact members to a surface of an interposer substrate;
• mounting a first surface of an IC die to a first surface of a bottom substrate, wherein the IC die includes a second plurality of electrical contact members;
• disposing an underfill compound between the first surface of the IC die and the first surface of the bottom substrate, wherein the underfill compound is embedded within the second plurality of electrical contact members;
• disposing an adhesive material at a plurality of locations on a second surface of the IC die;
• coupling the surface of the interposer substrate to the first surface of the bottom substrate, wherein the second surface of the IC die is bonded to at least a portion of the surface of the interposer substrate via the adhesive material;
• and
• coupling a third plurality of electrical contact members to a second surface of the bottom substrate opposite of the first surface of the bottom substrate.

An integrated circuit (IC) package comprising:

• an IC die having a first surface and a second surface opposite of the first surface, wherein the second surface of the IC die includes a first plurality of electrical contact members;
• a bottom substrate having a first surface and a second surface, the second surface of the bottom substrate being opposite of the first surface of the bottom substrate, wherein the first surface of the bottom substrate is coupled to the IC die via the first plurality of electrical contact members, wherein the second surface of the bottom substrate includes a second plurality of electrical contact members;
• a mold compound disposed on the first surface of the bottom substrate, wherein a third plurality of electrical contact members extend above a top surface of the mold compound;
• and
• an interposer substrate coupled to the top surface of the mold compound via an adhesive material, wherein the adhesive material is disposed at a plurality of locations on a surface of the interposer substrate and the top surface of the mold compound, wherein the interposer substrate includes the third plurality of electrical contact members, wherein the interposer substrate is coupled to the first surface of the bottom substrate via the third plurality of electrical contact members.