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US 9,070,615 B2Granted
Method for making a sensor device using a graphene layer
AssigneeInfineon Technologies AG
InventorsKlaus Elian, Guenther Ruhl, Horst Theuss, Irmgard Escher-Poeppel
Life of this patent
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Abstract
A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.
Claims25
A sensor device comprising:
- a substrate;
- a graphene layer disposed over the substrate;
- a plastic material disposed over the graphene layer;
- electrical contacts coupled to the graphene layer;
- and
- a polymer foil disposed over the plastic material, wherein the polymer foil comprises an opening exposing the plastic material.
3 more elements
An arrangement comprising:
- a carrier comprising carrier contacts;
- and
- a sensor device comprising:
- a substrate;
- a graphene layer disposed over the substrate;
- a plastic material partially disposed over the graphene layer, wherein the plastic material is deposited in a pre-structured, patterned form on the graphene layer to only cover specific zones of the graphene layer;
- and
- electrical contacts coupled to the graphene layer,
- wherein the electrical contacts of the sensor device are electrically connected to the carrier contacts of the carrier.
6 more elements
An arrangement comprising:
- a leadframe;
- and
- a sensor device comprising:
- a substrate;
- a graphene layer disposed over the substrate;
- a plastic material disposed over the graphene layer, wherein the plastic material comprises polyethylenterephtalate;
- and
- electrical contacts coupled to the graphene layer,
- wherein the electrical contacts of the sensor device are electrically connected to the leadframe.
6 more elements
A lead less package comprising:
- a metal chip pad, a first metal contact and a second metal contact disposed in a bottom surface of the package;
- a semiconductor chip disposed on the metal chip pad;
- a first electrical contact and a second electrical contact disposed at a top surface of the semiconductor chip, wherein the semiconductor chip comprises an integrated circuit configured to measure an empirical parameter between the first electrical contact and the second electrical contact;
- a first metal layer connection and a second metal layer connection, wherein the first metal layer connection connects the first electrical contact to the first metal contact and wherein the second metal layer connection connects the second electrical contact to the second metal contact;
- a graphene layer disposed over the semiconductor chip, wherein the graphene layer connects the first electrical contact and the second electrical contact;
- and
- a plastic material disposed over the graphene layer.
4 more elements
A sensor device comprising:
- an encapsulation body;
- a substrate disposed in the encapsulation body;
- a redistribution layer disposed on the substrate and the encapsulation body, wherein a first trace of the redistribution layer connects a first chip electrical contact to a first contact terminal on a first fan-out area of the encapsulation body and wherein a second trace of the redistribution layer connects a second chip electrical contact to a second contact terminal on a second fan out area of the encapsulation body;
- a graphene layer disposed over the substrate and connected to a third chip electrical contact and a fourth chip electrical contact;
- and
- a plastic material disposed over the graphene layer.
3 more elements
Dependencies are inferred from the claim text.