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US 9,070,610 B2Granted
Solid-state imaging device and electronic apparatus
AssigneeSony Corporation
InventorsKeiji Sasano, Hiroaki Tanaka, Hiroki Hagiwara, Yuki Tsuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Hirokazu Yoshida, Noboru Kawabata, Hironori Yokoyama
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Abstract
A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.
Claims15
A solid-state imaging device comprising:
- a substrate, the substrate having a first surface and a second surface that is opposite the first surface;
- an image sensor chip mounted on the first surface of the substrate, the image sensor chip having therein an imaging region and a peripheral circuit region so that both the imaging region and the peripheral circuit region are located on the image sensor chip, the imaging region and the peripheral circuit region of the image sensor chip being arranged along the first surface of the substrate;
- a signal processing chip mounted on the second surface of the substrate to process an output from the image sensor chip;
- and
- a low thermal conductivity region separate from the substrate and positioned between the image sensor chip and the signal processing chip,
- wherein,
- the low thermal conductivity region has a thermal conductivity lower than that of the substrate,
- the low thermal conductivity region is positioned with respect to the image sensor chip such that the low thermal conductivity region is disposed under the imaging region of the image sensor chip but does not extend to under the peripheral circuit region of the image sensor chip in a direction parallel to the first surface of the substrate along which the imaging region and the peripheral circuit region of the image sensor chip are arranged, and
- respective portions of the substrate are disposed under the peripheral circuit region of the image sensor chip, the respective portions of the substrate being between the image sensor chip and the signal processing chip.
6 more elements
An electronic apparatus comprising:
- (1) a solid-state imaging device including
- (a) a substrate, the substrate having a first surface and a second surface that is opposite the first surface,
- (b) an image sensor chip mounted on the first surface of the substrate, the image sensor chip having therein an imaging region and a peripheral circuit region so that both the imaging region and the peripheral circuit region are located on the image sensor chip, the imaging region and the peripheral circuit region of the image sensor chip being arranged along the first surface of the substrate,
- (c) a signal processing chip mounted on the second surface of the substrate to process an output from the image sensor chip, and
- (d) a low thermal conductivity region separate from the substrate and positioned between the image sensor chip and the signal processing chip;
- and
- (2) a control section configured to control the solid-state imaging device,
- wherein,
- the low thermal conductivity region has a thermal conductivity lower than that of the substrate,
- the low thermal conductivity region is positioned with respect to the image sensor chip such that the low thermal conductivity region is disposed under the imaging region of the image sensor chip but does not extend to under the peripheral circuit region of the image sensor chip in a direction parallel to the first surface of the substrate along which the imaging region and the peripheral circuit region of the image sensor chip are arranged, and
- respective portions of the substrate are disposed under the peripheral circuit region of the image sensor chip, the respective portions of the substrate being between the image sensor chip and the signal processing chip.
8 more elements
Dependencies are inferred from the claim text.