Back to results
US 9,070,568 B2Granted
Chip package with embedded passive component
AssigneeInfineon Technologies AG
InventorsKhalil Hosseini, Joachim Mahler, Georg Meyer-Berg
Life of this patent
Estimating the term…
Abstract
A chip package includes an electrically conducting chip carrier and at least one first semiconductor chip attached to the electrically conducting chip carrier. The chip package further includes a passive component. The electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component are embedded in an insulating laminate structure.
Claims19
A chip package, comprising:
- an electrically conducting chip carrier;
- at least one first semiconductor chip attached to the electrically conducting chip carrier;
- a passive component;
- and
- an insulating laminate structure embedding the electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component,
- wherein the passive component is arranged at a different level than the first semiconductor chip such that the passive component does not pass through any plane parallel to a main surface of the first semiconductor chip and intersecting the first semiconductor chip.
3 more elements
A chip package, comprising:
- an electrically conducting chip carrier;
- at least one first semiconductor chip attached to the electrically conducting chip carrier;
- a passive component;
- an insulating laminate structure embedding the electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component;
- and
- a second semiconductor chip,
- wherein the second semiconductor chip and the passive component are mounted on one another.
4 more elements
Dependencies are inferred from the claim text.