Bundled memory and manufacture method for a bundled memory with an external input/output bus

A bundled memory, comprising:

• a substrate;
• a first memory die having a first input/output bus and a first address bus, wherein the first memory die is formed over the substrate;
• a second memory die having a second input/output bus and a second address bus, wherein the second memory die is formed over the substrate;
• a scribe line formed between the first memory die and the second memory die;
• and
• an electrical connection formed over the scribe line for electrically connecting to the first input/output bus and the second input/output bus, or the first address bus and the second address bus, wherein the electrical connection is electrically connected to an external input/output bus, wherein the electrical connection comprises a plurality of masked layers formed over the scribe line, the plurality of masked layers from the electrical connection, and a plurality of test pads are formed over the plurality of masked layers and positioned over the scribe line, wherein the plurality of test pads are electrically connected to a plurality of external bonding pads.