Semiconductor device and manufacturing method thereof
AssigneeRenesas Electronics Corporation
InventorsDaisaku Kobayashi, Takayoshi Fujishiro
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AssigneeRenesas Electronics Corporation
InventorsDaisaku Kobayashi, Takayoshi Fujishiro
Estimating the term…
A semiconductor device includes a transistor formed by dividing into a first and a second areas, a source electrode pad connected with a first source region formed in the first area and a second source region formed in the second area, a drain electrode pad connected with a first drain region formed in the first area and a second drain region formed in the second area and a connection line to connect a first gate line and a second gate line, where the connection line being provided in a same layer as the first gate line formed in the first area and the second gate line formed in the second area. A wiring for connecting between nodes of another circuit can be provided over the layer having the connection line provided therein and thus the size of a circuit chip can be reduced.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.