Method for manufacturing a planar electronic device having a magnetic component

A method for manufacturing a planar electronic device, the method comprising:

• applying a non-conductive fluid polymer to a lower side of a planar substrate, the substrate including a hole extending through the substrate between the lower side and an opposite upper side of the substrate;
• curing the fluid polymer to form a solid centering layer on the lower side of the substrate, the centering layer extending across the hole along the lower side of the substrate;
• loading a ferrite material body into the hole of the substrate through the upper side of the substrate, the centering layer preventing the ferrite material body from moving beyond the lower side of the substrate;
• embedding the ferrite material body in an encapsulating material that is deposited into the hole and around the ferrite material body;
• and
• forming one or more conductive loops around the ferrite material body, wherein the ferrite material body is held within the substrate between the lower side and the upper side of the substrate by the encapsulating material,
• wherein applying the fluid polymer to the lower side of the substrate includes applying the fluid polymer to a supporting surface of a transfer board that is separate from the substrate, transferring the fluid polymer on the supporting surface to the lower side of the substrate, and removing the substrate and the solid centering layer from the supporting surface.

A method for manufacturing a planar electronic device, the method comprising:

• forming a hole in a planar substrate such that the hole has different diameter dimensions in different locations within the substrate between an upper side of the substrate and an opposite lower side of the substrate, the different diameter dimensions formed by an angled inner surface of the substrate that tapers the different diameter dimensions;
• applying a non-conductive fluid polymer to the lower side of the substrate, the substrate including the hole extending through the substrate between the lower side and the upper side of the substrate;
• curing the fluid polymer to form a solid centering layer on the lower side of the substrate, the centering layer extending across the hole along the lower side of the substrate;
• loading a ferrite material body into the hole of the substrate through the upper side of the substrate, the centering layer preventing the ferrite material body from moving beyond the lower side of the substrate;
• embedding the ferrite material body in an encapsulating material that is deposited into the hole and around the ferrite material body;
• and
• forming one or more conductive loops around the ferrite material body, wherein the ferrite material body is held within the substrate between the lower side and the upper side of the substrate by the encapsulating material.